Semitronics - High Reliability Semiconductors
Semitronics is a privately held manufacturer of military and commercial semiconductors, providing a full compliment of products and services from wafer fabrication to final test and assembly. Founded in 1957, Semitronics is MIL-PRF-19500 Certified and also provides custom packaging solutions and value added test services.
Products & Programs
Semitronics wide product range includes many devices which other manufacturers no longer produce. Custom devices are also available.
Semitronics is approved to supply Military products to Raytheon, Hughes, General Dynamics, Northrop, Lockheed Martin, Rockwell International Varo, Texas Instruments, United Technologies/Hamilton Standard, Hazeltine, BAE, Kearfott Guidance and Navigation and many other Military contractors.
Semitronics products have been approved for use on Military programs such as the Hawk, Patriot, ANRAM, Mach 48, TOW and the Space Shuttle. Their products also feature on many civil aviation products for power generation in rotating rectifier applications.
The Semitronics Quality program is approved by a number of Government Agencies and Contractors.
- Alloy Transistors
- Custom Products
- Inverter Grade SCR
- Phase Control SCR
- Power Transistor
- Solid State Relay
- Voltage Regulator
High Reliability Screening
Semitronics Hi-Rel devices are available tested to the Standard MIL / STX / STXV flows described in the chart or to your custom requirements using industry standard tests and quality assurance standards.
Semitronics has a wide range of testing capabilities that can be performed to meet your requirements. From simple dimension testing through gross and fine leak testing to full failure analysis, Semitronics has the range of capabilities to meet your requirements.
Semitronics Test and Measuring Equipment is calibrated in accordance with ANSI/ASCL ZS40-1-1-1994 and is traceable to the National Institute of Standards and Tests (NIST). Workmanship conforms to ISO 9000 Standards.
Semitronics is DSCC Certified to Full Appendix D of Mil-Prf-19500. Their Hi-Rel devices are available following the test procedures/flows of Mil-S-19500 and Mil Standard 883. Other Mil spec standards can be accommodated.
Where a particular component package is no longer available, repackaging die can be a more cost effective option than redesigning PCBs and seeking approvals. (Especially in avionic environments.) Semitronics can re-package discrete semiconductors and moderately complex semiconductors such as Op-Amps and similar devices. Typically the process is to package die into a hermetic style housing that a part was originally available in but has since gone out of production.
High Temperature Electronics
Some applications demand electronics that work at much higher temperatures than the usual Industrial or even Military range. From bore hole instrumentation to rotating rectifiers on aircraft engine, electrical-generators, high temperature operation has become a speciality for Semitronics.
With storage and operating temperatures up to 250 degrees C, Semitronics have the capability to deliver parts for the most demanding applications.
QML Part Number Listings
Semitronics maintains production of a number of JAN/JANTX devices.
Semitronics Testing Capabilities
Semitronics has an extensive range of test capabilities that may be used in the design and evaluation of devices for your program. To see the full range of capabilities use this link to the Semitronics web site.
Semitronics Quality Program
The Semitronics Quality program is approved by a number of Government Agencies and Contractors to meet or exceed the following specifications.
MIL-STD-15SE SAMPLING PROCEDURES AND TABLES FOR INSPECTION BY ATTRIBUTES
MIL-STD-109B QUALITY ASSURANCE TERMS AND DEFINITIONS
MIL-STD-120 GAGE INSPECTION
MIL-STD-129L MARKING FOR SHIPPING AND STORAGE
MIL-STD-130F IDENTIFICATION MARKING FOR U.S. MILITARY PARTS
MIL-STD-174 COLORS FOR CODING ELECTRONIC PARTS (SEE MIL-STD-1285A)
MIL-STD-202F TEST METHODS
MIL-STD-410E NONDESTRUCTIVE TESTING PERSONNEL QUALIFICATIONS AND CERTIFICATION
MIL-STD-414 SAMPLING PROCEDURES AND TABLES FOR INSPECTION BY VARIABLES FOR PERCENT DEFECTIVE
MIL-STD-454M STANDARD GENERAL REQUIREMENTS FOR ELECTRONIC EQUIPMENT
MIL-STD-480B CONFIGURATION CONTROL-ENGINEERING CHANGES, DEVIATIONS AND WAIVERS
MIL-STD-481B CONFIGURATION CONTROL-ENGINEERING CHANGES (SHORT FORM), DEVIATIONS AND WAIVERS
MIL-STD-726H PACKAGING REQUIREMENT CODES
MIL-STD-750C TEST METHODS FOR SEMICONDUCTOR DEVICES
MIL-STD-790E RELIABILITY ASSURANCE PROGRAM FOR ELECTRONIC PARTS SPECIFICATIONS
MIL-STD-1189B DEPARTMENT OF DEFENSE BAR CODE SYMBOLOGY
MIL-STD-1276D LEADS FOR ELECTRONIC COMPONENT PARTS
MIL-STD-1285A MARKING FOR ELECTRICAL AND ELECTRONIC PARTS
MIL STD-2073A DEPARTMENT OF DEFENSE MATERIAL PROCEDURE FOR DEVELOPMENT AND APPLICATION OF PACKAGING REQUIREMENTS
MIL-STD-2073-2B DEPARTMENT OF DEFENSE PACKAGING REQUIREMENTS
MIL-Q-9858A QUALITY PROGRAM REQUIREMENTS
MIL-T-10727C TIN PLATING: ELECTRODEPOSITED OR HOT-DIPPED, FOR FERROUS AND NONFERROUS METALS
MIL-F-14072D FINISHES FOR GROUND BASED ELECTRONIC EQUIPMENT